Industry Insights

Six suppliers take Nvidia’s prepayments, but the 2028 ramp stays unconfirmed In sum – what to know: Nvidia has announced capacity-expansion agreements with six manufacturing partners, spanning package substrates, advanced packaging, semiconductor testing, and optical engines for co-packaged optics. The partners are Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, SPIL, and Unimicron. Together, the deals underpin a supply-chain …

Maia 300 bets on tokens per watt, not peak compute In sum – what we know: Microsoft has unveiled the Azure Maia 300, the third generation of its custom AI accelerator, at the OCP Global Summit in San Jose. The chip won’t enter production until 2027, but Microsoft is already laying out plans for “multi-gigawatt deployments” once it does. According …

HBM4E triples bandwidth per stack, but volume production waits for 2027 In sum – what we know: Samsung and SK hynix have both shipped 12-high HBM4E samples to major customers, in what Samsung calls the first silicon of the seventh generation of high-bandwidth memory (HBM). Samsung’s shipment arrived in late May, with SK hynix following a few weeks later. Neither company has announced …

Three AI financing deals, one shared lender risk In sum – what we know: Three separate AI-hardware financing efforts surfaced at the same time this week, each enormous on its own, and collectively painting a picture of an industry scrambling to fund compute at a scale. Broadcom is reportedly arranging more than $50 billion tied to OpenAI’s custom-accelerator program, according …