Three AI financing deals, one shared lender risk In sum – what we know: Three separate AI-hardware financing efforts surfaced at the same time this week, each enormous on its …

In production now, but 2nm’s first prize for AI is efficiency TSMC has begun scaling its first 2nm-class process after entering volume production late last year, turning the shift from …

Cerebras capacity for agentic coding opens in Q1 2027 In sum – what we know: General Compute has announced a multi-year agreement to deploy Cerebras Systems’ wafer-scale AI inference hardware at scale. …

Both are 2nm with the same 5GHz Oryon CPU In sum – what we know: Qualcomm has split its flagship smartphone chip in two. The company has announced the Snapdragon 8 …

The AgentX result is impressive, but it rides on one specific operating point In sum – what we know: According to Nvidia, the Vera Rubin NVL72 rack system delivers up …

OpenAI is matching chips to workloads instead of picking one vendor In sum – what we know: OpenAI is slowly but surely moving away from Nvidia, and it’s doing so …

Bigger CoWoS packages may keep AI accelerators scarce anyway In sum – what we know: TSMC is reportedly preparing to roughly double capacity for its CoWoS advanced-packaging technology by the …

The Qualcomm deal covers custom inference silicon and 1.6T optical links In sum – what we know: Qualcomm and Amazon have announced a major partnership on September 8, 2026 that …

TSMC projects 1.9x tool demand within months In sum – what we know: TSMC is set for a dramatic expansion. News reports say the company is building 25 wafer-fabrication and …

Custom edge-AI SoC — but no confirmation from either company In sum – what we know: Samsung Electronics and Arm have reportedly started work on a custom on-device AI chip …