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Industry Insights
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Andrew Batson, global head of data center research at JLL, told RCR Wireless News that data center markets are still growing In sum – what to know: Hyperscale demand remains durable – AI is only part of the story, with cloud growth, traffic, and storage needs sustaining long-term expansion. Phased builds reduce risk – Developers are limiting exposure by building …
Once completed, the data center will cover around 2.78 million square meters on a site in Riyadh In sum – what to know: Government facility – SDAIA’s Hexagon project will span 2.78 million square meters in Riyadh and operate at Tier IV reliability. Sovereign AI – The site will host over 290 government systems, supporting national data, AI, and digital …
Can an assembly-line approach to high-density AI compute-in-a-box present a componentized answer to inefficient brick-and-mortar data centers? In sum – what to know: High-density AI cubes — Each cube offers ~0.6 MW of compute (500-600 kw per cube), with clusters of 4 – 6 MW, scaled to N. Containerized structure — an integrated system of power, cooling, UPS/BESS, which allows …
JLL estimates that AI-related uses could account for about half of total data center capacity by the end of the decade In sum – what to know: Global capacity set to nearly double – Data center capacity is projected to grow from 103 GW to 200 GW by 2030, with AI workloads making up around half of total demand. Investment …
Six suppliers take Nvidia’s prepayments, but the 2028 ramp stays unconfirmed In sum – what to know: Nvidia has announced capacity-expansion agreements with six manufacturing partners, spanning package substrates, advanced packaging, semiconductor testing, and optical engines for co-packaged optics. The partners are Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, SPIL, and Unimicron. Together, the deals underpin a supply-chain …
Maia 300 bets on tokens per watt, not peak compute In sum – what we know: Microsoft has unveiled the Azure Maia 300, the third generation of its custom AI accelerator, at the OCP Global Summit in San Jose. The chip won’t enter production until 2027, but Microsoft is already laying out plans for “multi-gigawatt deployments” once it does. According …
HBM4E triples bandwidth per stack, but volume production waits for 2027 In sum – what we know: Samsung and SK hynix have both shipped 12-high HBM4E samples to major customers, in what Samsung calls the first silicon of the seventh generation of high-bandwidth memory (HBM). Samsung’s shipment arrived in late May, with SK hynix following a few weeks later. Neither company has announced …
Three AI financing deals, one shared lender risk In sum – what we know: Three separate AI-hardware financing efforts surfaced at the same time this week, each enormous on its own, and collectively painting a picture of an industry scrambling to fund compute at a scale. Broadcom is reportedly arranging more than $50 billion tied to OpenAI’s custom-accelerator program, according …
During a session at RCR’s 6G Forum, Derek Khlopin, deputy associate administrator of NTIA’s Office of Spectrum, said the U.S. is pursuing a significant pipeline of spectrum for future wireless …
Autonomous networks must move beyond self-healing to coordinate decisions across RAN, transport, core and cloud, argues Droma’s Payal Kindiger, with trust, governance and verified service outcomes key to granting AI …
From the newsletter (October 21; sign-up or follow if you want it sooner): Nvidia and Nokia are pushing telcos to turn their networks and sites into distributed AI infrastructure, but …
Nokia CEO Justin Hotard told a conference call with investors that the company’s growth is accelerating in the areas where it has chosen to focus and invest, highlighting AI-RAN as …
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