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How you plan for this constraint could determine the fate of your AI architecture In sum – what to know: Inflection point is close — The thermal wall hits when air cooling reaches its physical limit at 40kW. HVAC to fluid dynamics — Liquid cooling is going from optional to unavoidable. Skills shortage pervades — Hire fluid dynamics engineers sooner …
The Nvidia H200 chip provides substantially higher memory bandwidth than the H20 — supporting faster AI data processing In sum – what to know: U.S. clears Nvidia’s H200 China sales under a 25% tariff – Approval reinstates advanced chip exports to vetted buyers despite national security concerns. Move aims to maintain U.S. tech influence in China – Allowing H200 access …
Singapore and Hong Kong remain two of APAC’s most strategically important data center hubs In sum — what to know Regulatory and land constraints – Swamy said Singapore has stayed “close to a thousand megawatt capacity” for years as approvals remain tightly controlled, with only 300 MW expected soon. U.S. operators dominate APAC’s growth pipeline – U.S.-owned or invested data …
OpenAI signed a MoU with NEXTDC to collaborate on a next-generation hyperscale AI campus and large GPU supercluster In sum – what to know: OpenAI launches its first APAC country program – OpenAI for Australia aims to expand sovereign AI infrastructure, workforce skills, and the national AI ecosystem. MoU with NEXTDC establishes a sovereign AI campus – A new hyperscale …
Six suppliers take Nvidia’s prepayments, but the 2028 ramp stays unconfirmed In sum – what to know: Nvidia has announced capacity-expansion agreements with six manufacturing partners, spanning package substrates, advanced packaging, semiconductor testing, and optical engines for co-packaged optics. The partners are Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, SPIL, and Unimicron. Together, the deals underpin a supply-chain …
Maia 300 bets on tokens per watt, not peak compute In sum – what we know: Microsoft has unveiled the Azure Maia 300, the third generation of its custom AI accelerator, at the OCP Global Summit in San Jose. The chip won’t enter production until 2027, but Microsoft is already laying out plans for “multi-gigawatt deployments” once it does. According …
HBM4E triples bandwidth per stack, but volume production waits for 2027 In sum – what we know: Samsung and SK hynix have both shipped 12-high HBM4E samples to major customers, in what Samsung calls the first silicon of the seventh generation of high-bandwidth memory (HBM). Samsung’s shipment arrived in late May, with SK hynix following a few weeks later. Neither company has announced …
Three AI financing deals, one shared lender risk In sum – what we know: Three separate AI-hardware financing efforts surfaced at the same time this week, each enormous on its own, and collectively painting a picture of an industry scrambling to fund compute at a scale. Broadcom is reportedly arranging more than $50 billion tied to OpenAI’s custom-accelerator program, according …

During a session at RCR’s 6G Forum, Derek Khlopin, deputy associate administrator of NTIA’s Office of Spectrum, said the U.S. is pursuing a significant pipeline of spectrum for future wireless …

Autonomous networks must move beyond self-healing to coordinate decisions across RAN, transport, core and cloud, argues Droma’s Payal Kindiger, with trust, governance and verified service outcomes key to granting AI …

From the newsletter (October 21; sign-up or follow if you want it sooner): Nvidia and Nokia are pushing telcos to turn their networks and sites into distributed AI infrastructure, but …

Nokia CEO Justin Hotard told a conference call with investors that the company’s growth is accelerating in the areas where it has chosen to focus and invest, highlighting AI-RAN as …
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